CTO David Aldape, 具有超过30年的行业经验，他带领一支专业的研发工程师队伍, 致力于不断加强当前生产工艺以 及先进技术的研发工作。
2016-2017研发项目：提高厚径比到30:1或更高；大而薄的背板能力；阻抗控制公差降到±5%或更小；先进电镀和光成形方法介绍；
提高层间对位的先进工具系统；持续验证新物料，用于HDI, 高速低损，更薄结构和组件应用（如ZETA®，I-Tera®, I-speed®,Tachyon G100®,Megtron7N,andEMC 891k&890）；深微孔研究（L1-L3，厚径比1:1或更大）；散热方案：金属芯板，导电浆（Ormet和Tatsuta）埋元器件PCB板
| Technology Roadmap 技术路线 | |||||
|---|---|---|---|---|---|
| inch [mm] | 标准 | 批量 | 样品 | 研发 | |
| 关键属性 | 层数 | Up to 32L | Up to 40L | 40L 到 48L | >50+L |
| 最小/最大厚度 | 012” [.30]/.200" [5.0] | .008" [.20]/.256" [6.5] | .006” [.15]/.315" [8.0] | TBD/≥.394" [10.0] | |
| 最大 pnl 尺寸 | 24x28[610x712] | 24x30 [610 x 760] | 24x32 [610 x 812] | 待定 | |
| 最小线宽线距（铜厚） | 内层 | .003" [.076] H | .0025" [.064] H | <.002" [.05] H | <.002" [.05] H |
| 外层 | .004" [.10] 1 | .003" [.076] 1 | <.0025" [.064] 1 | <.0025" [.064] 1 | |
| 公差 | ±.0005" [.013] | ±.0003" [.008] | ±.00025" [.005] | ±.0002" [.005] | |
| 机械孔大小 | 最小钻咀 | .008" [.20] | .006" [.15] | .005" [.13] | .004" [.10] |
| 孔pad直径 | +.008" [.20] | +.008" [.20] | +.006" [.15] | .004" [.10] | |
| 厚径比 | 25:1 | 30:1 | 40:1 | ＞40:1 | |
| Base copper weights: 1=1oz H=1/2 oz, T=3/8 oz, Q=1/4 oz | |||||
| 孔结构 | 镭射孔层 | 2+N+2 | 3+N+3 | 4+N+4,ELIC | UNiFYi MVs |
| 埋孔 | Yes | Yes | Yes | Yes | |
| 叠孔 | Stacked/Staggered | Offset/Staggered | Offset/Staggered | Offset/Staggered | |
| 镭射孔 | 最小孔 | .004" [.10] | .003" [.076] | .002" [.05] | .002" [.05] |
| 孔pad直径 | +.006" [.15] | +.004" [.10] | +.003" [.76] | +.003" [.076] | |
| 厚径比 | 0.8:1 | 0.8:1 | 1:1 | 1.2:1 | |
| 导通&非导通填孔 | 最小孔径 | .008" [.20] | .006" [.15] | .005" [.13] | <.005" [.13] |
| 厚径比 | 25:1 | 30:1 | 40:1 | ＞40:1 | |
| 阻焊 | 对位精度 | ±.002" [.05] | ±.0015" [.038] | ±.001" [.025] | Tangency |
| 最小开窗 | .004" [.10] | .003" [.076] | .002" [.05] | SMDP | |
| 最小绿油桥 | .003" [.08] | .002" [.05] | .0015" [.038] | Eng Eval | |
| 表面处理 | ENIG, OSP | ENEPIG | Thick Gold Multiple Finishes | 待定 | |
| Im Sn, Im Ag | Wire Bondable Gold | ||||
| LF HASL | Multiple Finishes | ||||
| Hard Gold Body | |||||
| 物料选择 | Rogers 3000/4000 | Ultra Low Loss Dk/Df | 埋线 埋元件 | ||
| Halogen Free FR4 EMC 828, EMC 888K | I-Tera® I-Speed® EMC 891K | Tachyon 100G® MetroWave | |||
| Buried Capacitance | Polyimid, Megtron 6N | Megtron 7N, EMC 890K | |||
| 408 HR Nelco-13s | Hybrid PCBs | Thermal Management PCBs | |||
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